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Area Array Package Design
Area Array Package Design
Author:
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Author:
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
ISBN-13: 9780071737739
ISBN-10: 0071737731
Publication Date: 10/24/2003
Pages: 220
Rating: ?
ISBN-10: 0071737731
Publication Date: 10/24/2003
Pages: 220
Rating: ?
0 stars, based on 0 rating
