Search - Characterization of Integrated Circuit Packaging Materials (Materials Characterization)

Characterization of Integrated Circuit Packaging Materials (Materials Characterization)
Characterization of Integrated Circuit Packaging Materials - Materials Characterization
Author: Thomas Moore
With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stres
ISBN-13: 9781606501870
ISBN-10: 1606501879
Publication Date: 3/1/2010
Pages: 274
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Publisher: Momentum Press
Book Type: Hardcover
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