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Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
Author: Rao Tummala
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a ...  more »
ISBN-13: 9780071371698
ISBN-10: 0071371699
Publication Date: 5/8/2001
Pages: 967
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Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
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