Search - List of Books by John H. Lau

Total Books: 14
Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive Materials
Microvias For Low Cost High Density Interconnects
2001 - Microvias for Low Cost High Density Interconnects (Hardcover)
ISBN-13: 9780071363273
ISBN-10: 0071363270
Genre: Engineering & Transportation
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Low Cost Flip Chip Technologies for DCA WLCSP and PBGA Assemblies
2000 - Low Cost Flip Chip Technologies for Dca Wlcsp and Pbga Assemblies (Hardcover)
ISBN-13: 9780071351416
ISBN-10: 0071351418
Genre: Reference
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Chip Scale Package Design Materials Process Reliability and Applications
1999 - Chip Scale Package Design Materials Process Reliability and Applications (Hardcover)
ISBN-13: 9780070383043
ISBN-10: 0070383049
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Electronic Packaging Design Materials Process and Reliability
Solder Joint Reliability of BGA CSP Flip Chip and Fine Pitch SMT Assemblies
1996 - Solder Joint Reliability of Bga Csp Flip Chip and Fine Pitch Smt Assemblies (Hardcover)
ISBN-13: 9780070366480
ISBN-10: 0070366489
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Flip Chip Technologies
1995 - Flip Chip Technologies (Hardcover)
ISBN-13: 9780070366091
ISBN-10: 0070366098
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Ball Grid Array Technology
1994 - Ball Grid Array Technology (Hardcover)
ISBN-13: 9780070366084
ISBN-10: 007036608X
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Chip On Board Technology for Multichip Modules
1994 - Chip on Board Technology for Multichip Modules [E; Ectrical Engineering] (Hardcover)
ISBN-13: 9780442014414
ISBN-10: 0442014414
Genre: Computers & Technology
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Handbook Of Fine Pitch Surface Mount Technology
1993 - Handbook of Fine Pitch Surface Mount Technology [Electrical Engineering] (Hardcover)
ISBN-13: 9780442012588
ISBN-10: 0442012586
Genre: Science & Math
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Mechanics of Solder Alloy Interconnects
1993 - Mechanics of Solder Alloy Interconnects [Electrical Engineering] (Hardcover)
ISBN-13: 9780442015053
ISBN-10: 0442015054
Genre: Science & Math
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Handbook Of Tape Automated Bonding
1992 - Handbook of Tape Automated Bonding (Hardcover)
ISBN-13: 9780442004279
ISBN-10: 0442004273
Genres: Reference, Science & Math, Engineering & Transportation
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Solder Joint Reliability Theory and applications