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Search - Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)

Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)
Microelectronics Packaging Handbook 3part set Part I Technology Drivers Part II Semiconductor Packaging Part III Subsystem Packaging - Part 3
Author: R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volum...  more »
ISBN-13: 9780412084614
ISBN-10: 0412084619
Publication Date: 1/31/1997
Pages: 3,000
Edition: 2nd
Rating:
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Publisher: Springer
Book Type: Paperback
Members Wishing: 0
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