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Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Reflow Soldering Processes and Troubleshooting SMT BGA CSP and Flip Chip Technologies
Author: Ning-Cheng Lee
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers,...  more »
ISBN-13: 9780750672184
ISBN-10: 0750672188
Publication Date: 12/15/2001
Pages: 280
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Publisher: Newnes
Book Type: Hardcover
Members Wishing: 0
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