Semiconductor Thermal Measurement and Management Symposium 1998 IEEE - Semi-Therm Author:IEEE Components Packaging & Manufacturin, IEEE These papers are the forum for presenting new developments in and applications relating to generation and removal of heat within semiconductor devices and the measurement of junction temperatures under various applications and environmental conditions. Thermal characterization of electronic parts, the modeling and analysis, and measurement of co... more »mponents is critical to the advancement of reliability of component performance. Recognition is made of the fact that component thermal tests and performances under isolated conditions are not matched by on the board thermal performances where the variables of heat flow are effected by packaging design. "~"Computational and Analytical Modeling; Management Methods; Thermal management; Optimization of Plate and Pin-Fin Hat Sinks; Air-Cooled Immersion Systems for High Flux Components« less