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Search - Manufacturing Process and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical ... December 1-6, 1991 (Amd (Series), V. 131.)

Manufacturing Process and Materials Challenges in Microelectronic Packaging: Presented at the Winter Annual Meeting of the American Society of Mechanical ... December 1-6, 1991 (Amd (Series), V. 131.)
Manufacturing Process and Materials Challenges in Microelectronic Packaging Presented at the Winter Annual Meeting of the American Society of Mechanical December 16 1991 V 131 - Amd Series
Author: William T. Chen, Ga.) American Society of Mechanical Engineers. Winter Meeting (1991 : Atlanta
ISBN-13: 9780791808962
ISBN-10: 0791808963
Pages: 153
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Publisher: Amer Society of Mechanical
Book Type: Paperback
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