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Tribology In Chemical-Mechanical Planarization
Tribology In ChemicalMechanical Planarization
Author: Hong Liang, David Craven
The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language tha...  more »
ISBN-13: 9780824725679
ISBN-10: 0824725670
Publication Date: 3/1/2005
Pages: 200
Edition: 1
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Publisher: CRC
Book Type: Hardcover
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