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Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield
Wire Bonding in Microelectronics Materials Processes Reliability and Yield
Author: George Harman
The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you step-by-step how to exploit new higherm d...  more »
ISBN-13: 9780070326194
ISBN-10: 0070326193
Publication Date: 6/1/1997
Pages: 290
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Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
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