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1998 2nd International Electronic Manufacturing Technology, Iemt/Imc
1998 2nd International Electronic Manufacturing Technology Iemt/Imc
Author: IEEE
This volume offers a broad spectrum of technical contributions in diverse areas of microelectronics interconnection and packaging technologies. Topics include: materials; flip chip/interconnection technologies; optical components and modules; and thin/thick film process technologies.
ISBN-13: 9780780350908
ISBN-10: 0780350901
Pages: 412
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Publisher: Institute of Electrical & Electronics Enginee
Book Type: Paperback
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