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3D IC Stacking Technology
3D IC Stacking Technology
Author: Banqiu Wu, Ajay Kumar, Sesh Ramaswami
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and ...  more »
ISBN-13: 9780071741958
ISBN-10: 007174195X
Publication Date: 7/7/2011
Pages: 544
Edition: 1
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Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
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