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Advanced MEMS Packaging (Electronic Engineering)
Advanced MEMS Packaging - Electronic Engineering
Author: John Lau, Cheng Lee, C. Premachandran, Yu Aibin
A comprehensive guide to 3D MEMS packaging methods and solutions Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechani...  more »
ISBN-13: 9780071626231
ISBN-10: 0071626239
Publication Date: 10/22/2009
Pages: 576
Edition: 1
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Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
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