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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Chip On Board Technology for Multichip Modules - E; Ectrical Engineering
Author: John H. Lau
Offers contributions from a wide array of experts who address areas covering the most advanced research and solutions in COB and MCM today. DLC: Electronic packaging.
ISBN-13: 9780442014414
ISBN-10: 0442014414
Publication Date: 1/15/1994
Pages: 555
Edition: 1st
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Publisher: Springer
Book Type: Hardcover
Members Wishing: 0
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