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Chip Scale Package: Design, Materials, Process, Reliability, and Applications
Chip Scale Package Design Materials Process Reliability and Applications
Author: John H. Lau, Ricky S.W. Lee, Ricky S. Lee
The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and ...  more »
ISBN-13: 9780070383043
ISBN-10: 0070383049
Publication Date: 2/28/1999
Pages: 564
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Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
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