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Copper Interconnect Technology (SPIE Tutorial Texts in Optical Engineering Vol. TT46)
Copper Interconnect Technology - SPIE Tutorial Texts in Optical Engineering Vol. TT46
Author: Christoph Steinbruchel, Barry Chin
Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solutions are being found.
ISBN-13: 9780819438973
ISBN-10: 0819438979
Publication Date: 3/2001
Pages: 130
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Publisher: SPIE-International Society for Optical Engine
Book Type: Paperback
Members Wishing: 0
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