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Search - IEEE International Workshop on Integrated Power Packaging: Iwipp Proceedings, the Congress Plaza Hotel Chicago, Illinois, Usa, September 17-19, 1998

IEEE International Workshop on Integrated Power Packaging: Iwipp Proceedings, the Congress Plaza Hotel Chicago, Illinois, Usa, September 17-19, 1998
IEEE International Workshop on Integrated Power Packaging Iwipp Proceedings the Congress Plaza Hotel Chicago Illinois Usa September 1719 1998
Author: IEEE
The aim of this volume is to provide a forum for technical communication focused on the needs and interests of power electronics components and system design engineers. Topics covered include: 3-D power packaging; CAD tools; EMI effects in packaging; fabrication techniques; and power supply.
ISBN-13: 9780780350335
ISBN-10: 0780350332
Pages: 400
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Publisher: Institute of Electrical & Electronics Enginee
Book Type: Paperback
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