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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Low Cost Flip Chip Technologies for DCA WLCSP and PBGA Assemblies
Author: John H. Lau
One-stop, cutting-edge guide to flip chip technologies. Now you can turn to a single, all-encompassing reference for a practical understanding of the fast-developing field that's taking the electronics industry by storm. Low-Cost Flip Chip Technologies, by John H. Lau, brings you up to speed on the economic, design, materials, process,equipment,...  more »
ISBN-13: 9780071351416
ISBN-10: 0071351418
Publication Date: 2/8/2000
Pages: 585
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Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
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