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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Author: Gerard Kelly
This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. Failures like delaminations, package cracking, and metal shift occur due to the build-up of residual stress and warpage in the packages because o...  more »
ISBN-13: 9780792384854
ISBN-10: 0792384857
Publication Date: 4/30/1999
Pages: 134
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Publisher: Springer
Book Type: Hardcover
Members Wishing: 0
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