Skip to main content
PBS logo
 
 

Search - Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Solder Joint Reliability of BGA CSP Flip Chip and Fine Pitch SMT Assemblies
Author: John H. Lau, Yi-Hsin Pao
This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balanc...  more »
ISBN-13: 9780070366480
ISBN-10: 0070366489
Publication Date: 9/1/1996
Pages: 408
Rating:
  ?
0 stars, based on 0 rating
Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
Reviews: Amazon | Write a Review



Back to the Top ↑
By using this Web site, you confirm that you have read, understood, and agreed to be bound by the Terms of Use. As an Amazon Associate we earn from qualifying purchases.
US Patent Number 7,877,315 | Copyright © 2004 - 2025 PaperBackSwap.com. All Rights Reserved.