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Microvias: For Low Cost, High Density Interconnects
Microvias For Low Cost High Density Interconnects
Author: John H. Lau, S.W. Ricky Lee
State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that?s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical eng...  more »
ISBN-13: 9780071363273
ISBN-10: 0071363270
Publication Date: 4/26/2001
Pages: 565
Edition: 1
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Publisher: McGraw-Hill Professional
Book Type: Hardcover
Members Wishing: 0
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